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ARM big.LITTLE multicore IP architecture wins a Microprocessor Report...
This week in the Microprocessor Report, the Linley Group announced its Analysts’ Choice Award winners and declared the ARM big.LITTLE multicore IP architecture as the best processor IP of the year:...
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3D Thursday: Altera adds Avago MicroPOD optical interconnects to FPGA package...
This week at the Optical Fibre Communication Conference and Exposition (OFC) in Los Angeles, Altera demonstrated a specially modified Stratix IV FPGA that handled bidirectional 100Gbps Ethernet...
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3D Thursday: TSMC talks more about Moore, More than Moore, and 3D ICs at...
Rick Cassidy, president of TSMC North America, gave a keynote speech at CDNLive! Silicon Valley this week and discussed 3D IC assembly in the context of Moore’s Law. “I think we can actually beat...
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3D Thursday: A quick look at glass interposers for 3D IC assembly
3D InCites just published a short piece on glass interposers for 3D ICs, as discussed at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ. If you’re interested...
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3D Thursday: The low down on low-power CPU-memory connections from EDPS
Earlier this month at EDPS, Marc Greenberg, Director of Product Marketing for the Cadence Design IP Group, said that Wide I/O SDRAM memory was going to drive the earliest adoption of 3D IC assembly...
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3D Thursday: Practical Approaches to 3-D IC—TSV/Silicon Interposer and Wide...
If you’re like me, you’ve heard more than enough theory about 3D IC assembly and you’re ready to get on with the main event and design something. Want to hear about 3D IC technology that works? Now?...
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3D Thursday: Electronics Component and Technologies Conference in San Diego...
The Electronics Component and Technologies Conference being held in San Diego on May 29-June 1 will provide you with several significant opportunities to come up to speed on 3D IC assembly and related...
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Moore’s Law: Wanted, Dead or Alive
Moore’s Law is not dead but the vital signs have clearly changed. That was the key message I heard from Dr. Subramanian Iyer, Fellow and Chief Technologist at the IBM Systems & Technology Group,...
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3D Thursday: The “King of 3D ICs” (Herb Reiter) speaks to his subjects—“Learn...
Mr. 3D IC—aka Herb Reiter—spoke to an attentive group of packaging experts about the state of 3D IC technical and business development today at a MEPTEC luncheon held at the “luxurious” Biltmore Hotel...
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3D Thursday: Intel Penwell SoC for mobile phones employs POP...
Wednesday at the Hot Chips 24 conference, Rumi Zahir of Intel discussed the company’s Penwell SoC designed for cell phone handsets. The SoC is employed in the Medfield cellular handset design and it’s...
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