The Electronics Component and Technologies Conference being held in San Diego on May 29-June 1 will provide you with several significant opportunities to come up to speed on 3D IC assembly and related topics including:
- Session 1 on 3D Interconnect
- Session 8 on 3D Reliability
- Session 13 on 3D TSVs
- Session 20 on Co-Design for the 3D Ecosystem
- Session 25 on 3D Integration
- Session 31 on 3D Applications
- Session 34 on 3D packaging
In addition, there are several 3D professional courses being given on May 29 including:
- 3D INTEGRATION: ALTERNATIVE TO CONTINUED SCALING by Philip Garrou – Microelectronic Consultants of NC
- TECHNOLOGY ADVANCES IN 3D-TSV INTEGRATION AND PACKAGING OF MICRO-NANOSYSTEMS by James J.Q. Lu – Rensselaer Polytechnic Institute
- 3D IC PACKAGING & INTEGRATION AND 3D SI INTEGRATION by John Lau – Industrial Technology Research Institute
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